PANJIT Semiconductor Unveils New High Power Bridge Rectifier Diodes
PANJIT, a prominent name in the semiconductor industry, has launched its advanced Ultra-Low VF Bridge Rectifier Series, incorporating cutting-edge oxide planar chip junction technology and PI protection for enhanced efficiency and dependability in high-power applications.
The standout feature of PANJIT's Ultra-Low VF Bridge Series is its impressive operational efficiency, marked by an extremely low forward voltage drop of only 0.74 V at 125°C. This innovation not only curtails power loss but also boosts overall power management efficiency. The series boasts a substantially low leakage current rating of 20 µA at the same temperature, fostering effective power conveyance, and bolstering system dependability and resilience against challenging operational environments.
The series leverages PANJIT's excellence in wafer fabrication process stability, delivering consistent and superior performance tailored for a range of demanding scenarios, such as server, artificial intelligence, telecommunications, gaming power solutions, and high-efficiency 80+ platinum and titanium PC power supplies.
Committed to environmental stewardship, PANJIT has designed the Ultra-Low VF Bridge Series with sustainability at its core. The improved efficiency not only augments product performance but also aligns with eco-friendly initiatives. Fully adhering to EU RoHS 2.0 and the IEC 61249 halogen-free standards, the series significantly diminishes environmental impact, placing PANJIT at the forefront of eco-conscious semiconductor solutions.
The Ultra-Low VF Bridge Series by PANJIT distinguishes itself with three pioneering advancements, charting a new course for bridge rectifiers and signaling a robust and green trajectory for the next generation of electronic components.
- Highest Forward Current in the Industry (IF = 35 A)
- Lowest Forward Voltage in the Industry (VF = 0.74 V)
- Maximum Operating Junction Temperature of 175 °C (TJ Max.), maximize the efficiency of high-power applications and improve heat dissipation capabilities.
